Reliability Data

Reliability and Qualification of the Ormet®
Printed Jumper Technology

The Ormet® printed jumper wire technology was fully qualified in a three-year study by Nortel. The results of this study were published in the Nepcon West '96 Proceedings.*

Summary of Nortel Evaluation of Ormet® Printed Jumper Technology
Evaluation Criteria	Conditions	Pass or Fail
Preconditioning with solder, shipping and storage cycles	2 wave solder, 2 reflow solder, 2 repair solder, 10 shipping and 10 humidity cycles	Pass
Stable resistance with temperature and humidity	35C / 85% RH 1000 hours 85C / 85% RH 1000 hours	Pass Pass
Thermal cycling	-40C to +100C -20C to +70C	Pass Pass
Resistance stability with flexure	As preconditioned Heat aged @ 125C for 1000 hours	Pass Pass
Dielectric isolation	100V bias 24 hours 10V bias 1000 hours	Pass Pass
Cross section analysis of mechanical integrity	Dielectric and PTF Conductor mechanical connection	Pass

*John Peterson, "Polymer Thick Film Ink (PTF): Material and Product Reliability Testing," Proceedings of the Technical Program, Nepcon West '96, pp. 1733-42.

The Conductive Circuits Inc. PCB conductive ink modification process is IPC approved per IPC specification 7721 / 4.2.6